Photomask/Reticle plays a crucial role in advanced semiconductor packaging, and its core function is similar to that in the front-end of wafer manufacturing (FEOL): accurately defining the pattern on the photoresist to form the required metal wiring, vias, bumps, and other structures on the substrate or wafer. With the development of advanced packaging technology towards higher density, smaller size, and more complex interconnects, the application of mask plates has become more refined and critical.